SOI


Short for silicon-on-insulator, a type of semiconductor fabrication technique developed by IBM. Unlike CMOS-based chips that are doped with impurities that enable a chip to store capacitance that must be discharged and recharged, SOI chips are formed by setting transistors on a thin silicon layer that is separated from the silicon substrate by an insulating layer of thin silicon oxide or glass, which minimizes capacitance (or the energy absorbed from the transistor).

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  • SOIC

    Short for Small Outline Integrated Circuit. A SOIC package is a leaded rectangular surface mount integrated circuit with eight or more gull wings leads, bent outwards at the tip. The leads are on two length sides of the package. SOIC packages are JEDEC compliant.

  • SOJ

    Short for Small-Outline J-lead, a type of chip module that uses J-shaped pins that extend inwards. Unlike DIPs, which plug into holes on the circuit board, an SOJ chip attaches directly to the circuit board’s surface.

  • SOM

    Short for System Object Model, an architecture developed by IBM that allows binary code to be shared by different applications. It serves the same purpose as Microsoft’s competing COM standard. SOM is a full implementation of CORBA. A distributed version of SOM that allows binary objects to be shared across networks is known as DSOM.

  • Synchronous Optical Network (SONET)

    Short for Synchronous Optical Network, a standard for connecting fiber-optic transmission systems. SONET was proposed by Bellcore in the middle 1980s and is now an ANSI standard. SONET defines interface standards at the physical layer of the OSI seven-layer model. The standard defines a hierarchy of interface rates that allow data streams at different rates […]

  • SOP

    Short for Small Outline Package, it’s a low-profile rectangular surface-mount component package. Its chip is bonded to an inner land contact area (usually a lead frame). External terminals exit parallel to the seating plane on two opposite sides of the moulded, flat package. SOPs use gull wing formed leads, and is a surface mount package […]


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